At GE Aviation in Dayton, OH the EPISCenter is the headquarters for all of Aviation Power Engineering. At this facility you have an opportunity to put your engineering training and skills to use. Our Engineers are focused and challenged on developing new technologies and delivering state of the art products such as Hybrid Electric aircraft, the latest military platforms, and SiC technology to name a few. Plus, if you like hands-on work, there is also a 155,000 sq ft lab that includes 6 high power test cells totaling 15 MW, an EMI chamber, an electronics lab, a rapid build prototype lab, and a real time simulator lab with all the latest equipment.
Roles and Responsibilities
- Execute the design, analysis, or evaluation of assigned Electronics Packaging projects using sound engineering principles and adhering to business standards, practices, procedures, and product /program requirements
- This work would include mechanical and/or electrical engineering across multiple product lines to best define the design and qualification requirements for power generator control units and associated electronics packages
- Utilizes in-depth knowledge of a technical discipline and analytical thinking and technical experience to execute policy/strategy
- Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market
- Uses some judgment and has some ability to propose different solutions outside of set parameters to address more complicated designs and manufacturing processes with technical variety and/or interdependent production cycles
- Uses technical experience and analytical thinking
- Uses multiple internal and limited external sources outside of own teams to arrive at decisions
Required Qualifications
- Bachelor's degree from an accredited university or college
- A minimum of 3 years of experience in an engineering role
- This role requires use of technical data subject to U.S. Government contract restrictions and this posting is only for U.S. Citizens. GE will require proof of status.
Desired Characteristics
- Ability to work independently
- Strong problem solving skills
- Master’s Degree from accredited university or college
- Ability to perform stress, fatigue, thermal and vibration finite element analyses using ANSYS software including Icepak
- Experience in the packaging of high temperature and high power electronics modules
- Experience in thermal materials and solutions
- Experience in aerospace component design and packaging
- Ability to perform tolerance stackups and experience with G, D & T
- Experience in design for shock and high vibration environments
- Experience in commercial certification or qualification regimes of aerospace products
- Strong interpersonal and leadership skills
- Ability to write test procedures and test reports
- Understanding of Design for Manufacturing Understanding of manufacturing cost and reproducibility
- Experience with Unigraphics (NX)
- Strong oral and written communication skills
- Demonstrated ability to analyze and resolve problems
- Ability to document, plan, market, and execute programs
Some of our competitive benefits package includes:
- Medical, dental, and vision insurance that begins on the first day of employment
- Permissive time off policy for newly hired employees
- Generous 401(k) plan
- Tuition Reimbursement
- Life insurance and disability coverage
- And more!